Objective: To investigate the influence of substrate-temperature on SBS (shear-bond-strength) of 4 self-etching dual- and / or self-curing adhesive systems. Methods: The adhesives tested were AdheSE (AD) in combination with an experimental dual-cure Activator and Optibond Solo Plus Self-Etch Adhesive System (OS; Kerr, Orange, USA) with the corresponding dual-cure Activator, Multilink (ML) and Panavia 21 (PA; Kuraray, Okayama, Japan). Three substrate temperatures, 3°C, 25°C and 37°C were used. The adhesives were tested using a light- (lc), self- (sc) or dual-curing (dc) protocol according to manufacturers instructions. For each group 5 bovine incisors were polished with P1000 grit to expose dentin respectively enamel. After storage the tooth in water at particular temperature for at least 20 min (maximum 1h), the adhesive was applied at 25°C according to the particular protocol. The self-/dual-curable cement Variolink for OS and AD group, Multilink for ML and Panavia 21 for PA was applied to a precured composite-button (4mm diameter, 3mm height). All adhesives and cements were temperated at 25°C. After storage for 24h at 37°C in water SBS was measured according to ISO/TS11405. ANOVA was used to determine inter-group differences (p<0.05). Results: A statistically significant increase of SBS-values from the 3°C to the 25°C Group was found. For ADsc and ADdc the increase was approximately 50% and for MLsc and PAsc about 30%. No significant temperature dependency between the 3°C and 25°C was found for the OSdc and OSlc Group. SBS-values on both substrates are rather low. No differences were found between the 25°C and 37°C Groups for all Systems. Conclusion: For SBS-measurements of chemical curing adhesive systems the substrate-temperature at application affects the test results. For shear bond experiments of chemical curing bonding systems a substrate temperature of at least 25°C is recommended.

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