| 3123 Enamel and dentin adhesive bond strenght conditioned with boric acid | ||
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L.C. COSTA, Bauru Dental School, Brazil, and J.C. PEREIRA, Bauru Dental School, Brazil Objectives:The aim of this laboratory work was to evaluate the bond strength and etching pattern of dentin and enamel conditioned by 2% boric acid.Methods:Human third molars etched with 35% phosphoric acid and different solutions of 2% boric acid were utilized. For the etching pattern determination discs of dentin and square enamel specimens were conditioned (35% phosphoric acid and 2% boric acid solutions) and prepared for scanning electron microscopic observations. For dentin and enamel bond strengths evaluation the microtensile test was used. Phosphoric acid (35%) and boric acid (2%) were utilized in combination with two adhesive systems (Single-Bond and Prime & Bond NT) and two different composite resins (Z-250 and TPH).After bonding procedures, the teeth were sectioned and the obtained specimens submitted for microtensile tests.The results were analyzed by ANOVA followed Tukey's analysis at a significance level of 5% (p<0,05).Results:The 35% phosphoric acid solution presented higher demineralization power when compared to 2% boric acid solutions either in dentin or enamel. Regarding to the bond strength in dentin, when 35% phosphoric acid solution was used in combination with Single-Bond adhesive system and Z-250 composite resin the values were significantly higher when compared to other acid solutions. Therefore, whem the Prime & Bond NT adhesive system and TPH composite resin were utilized, no statisticaly different values were demonstrated for bond strenght among different acid solutions. In enamel, different acid solutions were also combined with Single-Bond and Prime & Bond adhesive systems and Z-250 and TPH composite resins. Groups etched with 35% phosphoric acid solution presented bond strength values significantly higher than other acid solutions. Conclusion:The utilization of 2% boric acid solution for etching dentin or enamel did not provide characteristics in this substrates and bond strength values similar to 35% phosphoric acid solution.
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| Seq #335 - Adhesion III 10:15 AM-11:30 AM, Saturday, 13 March 2004 Hawaii Convention Center Exhibit Hall 1-2 | ||
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Back to the Dental Materials: I - Adhesion-Composite Bond Strength Program
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