3122 Influence of Thermal Cycling on Adhesion of Various Self-Etching Adhesives
J. SANG, H. LIU, and L.C. HAYES, Dentsply International, L.D. Caulk Division, Milford, DE, USA

Objectives: To examine the effect of thermal cycling on enamel and dentin shear bond strength (SBS) of various self-etching adhesives (SEA). Methods: Seven SEA were selected for this study: experimental Dual Cure Self-Etching Prime&Bondâ (SEPB, Dentsply), experimental one-pack Self-Etching Adhesive (EXPSEA-1, Dentsply), Adper Prompt L-Pop (LP, 3M ESPE), ClearFil SE Bond (SE, Kuraray), Xeno III (Xeno, Dentsply), iBond (iB, Kulzer) and Touch&Bond (TB, Sun Medical). Extracted human molars were wet ground to expose a flat enamel or dentin surface with 600-grit silicon carbide paper. Seventy teeth were randomly assigned to fourteen groups (n=5/group). Using a gelatin capsule as matrix, Prisma TPH Spectrum composite (Dentsply) was bonded to ground enamel or dentin surfaces treated with various SEA per each manufacturer's instruction. SBS specimens were stored in 37 ° C water for 24 hours before thermal cycling 1800 times between 55/5 °C water bath. Compressive SBS was measured using an Instron machine at a crosshead speed of 5 mm/minute. Means and standard deviations (n=5) of enamel and dentin SBS (in MPa) are listed below. Data were analyzed with one-way ANOVA and Duncan post-hoc test (p≤ 0.05).

Results:

SEPB

EXPSEA-1

LP

SE

Xeno

iB

TB

Enamel

35.6 (3.3) A

28.3 (9.3) A

21.0 (3.9) B

25.7 (6.7) A

26.3 (8.8) A

12.5 (5.9) C

13.3 (2.8) C

Dentin

16.5 (2.8) b

21.1 (4.4) a

14.4 (2.6) b

21.2 (4.6) a

17.6 (3.1) b

12.6 (6.3) c

16.8 (2.6) b

Means with same superscript (uppercase for enamel, lowercase for dentin) are not statistically different.

Conclusions: Thermal cycled enamel SBS of SEPB, EXPSEA-1, SE and Xeno was significantly higher than LP, iB and TB. EXPSEA-1 and SE showed significantly higher thermal cycled dentin SBS than others did among which iB gave lower dentin SBS than SEPB, Xeno, LP, and TB.

Seq #335 - Adhesion III
10:15 AM-11:30 AM, Saturday, 13 March 2004 Hawaii Convention Center Exhibit Hall 1-2

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