| 3121 Bond Strength of Self-Etch Adhesives Using Different Techniques | ||
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A. GONZALEZ, Universidad de Costa Rica, School of Dentistry, San Pedro, Costa Rica, and D. LAFUENTE, Universidad de Costa Rica, School of Dentistry, San Pedro, Costa Rica Purpose: To evaluate the shear bond strength of One Up Bond F with the additional acid etching. The influence of the size of the bonded area on the bond strength was also evaluated. Methods: Twenty recently extracted human molars were embedded in acrylic and polished with 600 grit SiC paper until superficial dentin was exposed. Divided in two groups, one group received the Self-etch adhesive following manufacturerxs instructions, the other was acid etch with 37% phosphoric acid for 15 seconds before applying the adhesive. Each group was then divided in two more groups (n=5), to bond composite over them. One group had a cylinder 1 mm diameter, the other was 2 mm diameter. Specimens were stored in water for seven days at 37º C before being tested for shear in the Universal Testing Machine (Instron 1000) at a crosshead speed of 0.1 cm/min. Data were recorded in MPa and analyzed using a two way analysis of variance calculated at a 0.05 significance level. Tukey-Kramer interval for comparison of means was 14.0 also calculated at a 0.05 significance level. Results: Means and standard deviations in MPa are shown in table. The bonding area significantly influences the bond strength result. 1 mm diameter bonding area increased the result for the same adhesive bonded on 2 mm diameter bonding area. The addition of acid etching to the steps prior to the application of the dentin bonding agent did not improved the bond strength, and with the 1 mm diameter bonding area, the bond strength was statistically higher without the acid etching With Etching Without Etching 1 mm diameter 49,9 (14,3) 67,3 (23,0) 2 mm diameter 21,7 (2,6) 21,3 (2,4) Conclusion: Bond strength results were statistically higher when the bonded area was smaller. Acid etching the dentin did not improved the bond strength. | ||
| Seq #335 - Adhesion III 10:15 AM-11:30 AM, Saturday, 13 March 2004 Hawaii Convention Center Exhibit Hall 1-2 | ||
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