| 3141 Effect of Thermal Cycling on Nanoleakage of Dual-cure Resin Cements | ||
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T. KANNO1, R.M. FOXTON2, M. NAKAJIMA1, J. TAGAMI3, and H. MIURA1, 1Tokyo Medical & Dental University, Japan, 2Guy's, King's and St.Thomas' Dental Institute, London, United Kingdom, 3COE Program, FRMDRTB at TMDU, Tokyo Medical and Dental University, Tokyo, Japan Objective: The purpose of this study was to evaluate the effects of thermal cycling on nanoleakage between dual-cure resin cement and root canal dentin. Methods: Ten extracted bovine teeth had their crowns were removed, and post spaces prepared (3mm wide, 12mm deep) in the root canals, using a carborundum point (Shofu, HP20) with copious water spray. Two dual-cure resin cements (Panavia F 2.0, Kuraray; Linkmax, GC) used in this study. The resin cement was placed in the post cavity and also covered on the top of root, followed by light-cured for 60s from coronal direction. After storage in water for 24 hours at 37°C, the specimens were divided equally into two groups; control and thermal cycling groups. After thermal cycling between 5°C and 55°C for 1000 cycles, the specimens were immersed in 50% AgNO3 for 8 hours, followed by immersion in a photo developing solution for 24 hours. The specimens were sectioned perpendicularly to the long axis and observed under a confocal laser scanning microscope for determination of lateral silver penetration within the interface. The data (mean ± SD, mm) were analyzed by one-way ANOVA and Scheffe's post-hoc test (p<0.05). Results: The silver penetrations of Panavia F 2.0 and Linkmax in the control groups were 264.4±197.7 and 211.8±122.9mm, respectively. After thermal cycling, Panavia F 2.0 and Linkmax were 378.0±232.5 and 208.1±110.8mm, respectively. There were no significant differences between the control and the thermal cycling groups (p>0.05). Silver deposits were not observed within the interface of the post cavities. Conclusion: Thermal cycling did not influence nanoleakage within the interface between dual-cure resin cement and root dentin. | ||
| Seq #335 - Adhesion III 10:15 AM-11:30 AM, Saturday, 13 March 2004 Hawaii Convention Center Exhibit Hall 1-2 | ||
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