3108 Ground Enamel Shear Bond Strength of Adhesives after Bleaching
Y. WANG, L.J. SHARP, and B.I. SUH, Bisco, Inc, Schaumburg, IL, USA

<>Objective: To investigate ground enamel bond strength loss of currently popular adhesives after bleaching procedure, in vitro. Method: Each adhesive was tested by two protocols. They are with (B. R) and without (B.) reducing agent treatment after bleaching. Ground enamel was imbedded in acrylic mold, and was finished with 320 grit SiC sand paper. Opalescence Xtra® (Ultradent) with 35% of H2O2 was applied to enamel surface prepared. Agitation was applied after 5minutes and followed by 20s light curing at 500mW/cm2 for 10min. Bleach gel was rinsed off with a strong stream of water for 30s. In B.R group, strong reducing agent 50%Na2S2O3 was applied for 20s with agitation by a brush, and then was rinsed off by water. Shear bond strength (SBS) of One-Step (OS) (Bisco), Single Bond (SB) (3M), Solo Plus (SP) (Kerr), Prime Bond NT (PB) (Dentsply) and new Bisco experimental version, Bleach N' Bond (BB) was measured after etching of immediately bleached enamel for 15s with 32% H3PO4(Uni-Etchâ/Bisco), and soaking bonded specimens in DI water for 2hr. at 37°C. Control data was tested without bleaching and reducing procedure. Data analyzed by ANOVA followed by Student-Newman-Keuls test.  <>Results:    (Bonding area=0.1521cm2, Shear speed = 5mm/min)

Group (n=5)

BB (sd)

<>SB

SP

OS

PB

Control MPa (sd)

24.83(2.35)

20.7(3.62)

22.56(1.85)

27.69(2.79)

22.42(4.19)

B group MPa (sd)

23.70(4.01)

14.17(3.93)

19.38(2.06)

15.58(2.24)

17.49(1.56)

SBS retention

95.4%

68.5%

85.9%

56.3%

78.0%

B.R group MPa (sd)

22.48(2.62)

15.86(1.88)

16.39(2.05)

14.64(2.79)

16.81(1.26)

<>Conclusion: 1) For most adhesives tested, SBS of ground enamel appears decreasing from 15 to 50% after bleaching; 2) Statistically among the adhesives tested, ground enamel SBS of BB was the only one to be able to remain the same bond strength after bleaching; 3) Reducing agent did not help to eliminate lower bond strength caused by bleaching.

Seq #335 - Adhesion III
10:15 AM-11:30 AM, Saturday, 13 March 2004 Hawaii Convention Center Exhibit Hall 1-2

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