2669 Adhesion of a Newly Developed Sealer to Dentin
F. KONT COBANKARA, H.C. ALTINOZ, and S. BELLI, Selcuk University, Faculty of Dentistry, Konya, Turkey

Aim: Adhesion of root canal sealers to dentin is an important property for long term success of the root canal sealer by maintaining the integrity of the seal of root canal fillings. The purpose of this study was to evaluate dentin adhesion of a recently developed sealer RC Sealer (Sun Medical Co., Ltd., Japan) comparing with commercial root canal sealers, RoekoSeal (Roeko, Langenau, Germany), silver-free AH26 (Dentsply, De Trey, Konstanz, Germany) and Ketac-Endo (ESPE, GBMH & Co., Seefeld-Oberbay, Germany). Material and Methods: 60 extracted human non-carious third molar teeth were used. The crowns were cut from the middle third and pulp chamber roof dentin surfaces were used for tensile strength test. Root canal sealers were placed onto the specimens' surface at an angle of 90 degree by the help of a specially designed steel apparatus and allowed to set for 7 days in an incubator providing a moist atmosphere at a temperature of 37oC. This set-up was then placed into a steel frame which was designed for Testometric Universal Testing Machine. Tensile strength values were measured, calculated as MPa and evaluated statistically. Results: The results of the study revealed that there were not statistically significant difference among RC Sealer and AH26 (p>0.05). RoekoSeal's adhesion was also similar that of Ketac-Endo (p>0.05). However both adhesion of RC Sealer and AH26 were better than Ketac-Endo and RoekoSeal (p<0.05). Conclusion: It was concluded that all of the tested materials have adhesive properties however RC Sealer and AH26 have better adhesion potential when compared to Ketac-Endo and RoekoSeal.

Seq #271 - Properties of Endodontic Materials
11:00 AM-12:15 PM, Saturday, 28 June 2003 Svenska Massan Exhibition Hall B

Back to the Dental Materials: VIII - Others-Non-metallic Program
Back to the 81st General Session of the International Association for Dental Research (June 25-28, 2003)

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