Objectives: The purpose of this study was to evaluate the bond strength of adhesive cement to Ga- and In-added Ag-Pd-Au-Cu alloys and to investigate the effect of the addition of Ga and In on the bond strength. Materials and Methods: Ag-Pd-Au-Cu alloys were experimentally prepared in an argon atmosphere using an induction-melting unit. The basic compositions of the prepared alloys were 20%, 30% and 40%Pd, 10%, 15%, and 20%Cu, 20%Au and Ag as balance. Two percent and four percent of Ga or In were added to these nine compositions. The original alloys without additives were also prepared and thus a total of 45 alloys were evaluated. A disc-shape specimen with a screw was made from these alloys using a dental casting procedure. Two disc-shape specimens were placed in an alignment unit and were bonded using adhesive cement (Superbond C&B, Sunmedical, Japan) under 15kgf for 30min. The tensile bond strength of the specimen was measured for each alloy composition. The data were statistically analyzed using ANOVA. Results: The average bond strength ranged from 38.4 to 44.1 MPa for Ga-added alloys, 42.2 to 47.3 MPa for In-added alloys and 33.1 to 42.5 MPa for the original alloys without these additives. Both Ga and In significantly increased the bond strength. The effect of Ga on the bond strength significantly varied with Pd content, and that of In both with Pd and Cu contents. The highest increase was 16.2% for the Ga-added alloy and 40.8% for the In-added alloy. The bond strength was also significantly influenced both by Pd and Cu contents. Higher Cu content (15 and 20%) resulted in the increase in the bond strength at higher Pd content (30 and 40%). Conclusion: The addition of Ga and In to Ag-Pd-Au-Cu alloys is effective in increasing the bond strength of the adhesive cement.

Back to the Dental Materials: II - Adhesion-Other Program
Back to the 81st General Session of the International Association for Dental Research (June 25-28, 2003)

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